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semiconductor MSM7512B 1/12 general description the MSM7512B is useful for the itu-t v.23 modem, for examples, low cost built-in modems, telecontrol systems, home security systems, etc. the family version, msm7510 for itu-t v.21, will be available following this device. oki has been mass-producing and delivering the msm6926 and 6927 for a long time, but these devices need two power supplies, +5 v for digital and +12 v for analog. new generation devices, msm7510/7512b, work with single rail +3 v to +5 v and low power consumption. features ? conforms to itu-t v.23, 1200 bps half duplex ? conforms to itu-t v.23, 75 bps transmitter ? single power supply: +3 v to +5 v ? low power consumption operating mode: 25 mw typ. power down mode: 0.1 mw max. ? line hybrid circuit on chip ? line direct drive capability of analog output ? 3.579545 mhz crystal oscillator ? digital interface: ttl ? package options: 16-pin plastic dip (dip16-p-300C2.54) (product name: MSM7512Brs) 24-pin plastic sop (sop24-p-430-1.27Ck) (product name: MSM7512Bgs-k) ? semiconductor MSM7512B 1200 bps half duplex fsk modem C itu-t v.23 e2a0014-16-x0 this version: jan. 1998 previous version: nov. 1996
semiconductor MSM7512B 2/12 block diagram ai (2) x1 (6) x2 (7) v dd (1) clk (8) rd (9) cd (10) xd (11) rs (12) cont. demodulator modulator C + *r1 *r2 ao (3) *r3 *r2 aog *r2 eai (4) test (13) mod1 (14) mod2 (15) aog (16) clk gen. osc sg gen. gnd (5) * r1 to r3 3 50 k w ( ) : for MSM7512Brs *r1 fsk & ans bandpass filter C +
semiconductor MSM7512B 3/12 pin configuration (top view) 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 v dd ai ao eai gnd x1 x2 clk aog mod2 mod1 test rs xd cd rd 16-pin plastic dip 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 v dd nc ai ao eai x1 nc x2 aog nc mod2 nc nc cd nc clk nc rd 24-pin plastic sop nc : no connect pin nc gnd mod1 test rs xd
semiconductor MSM7512B 4/12 pin description note : i* : internally pulled-up input pin. 11 v dd +3 v to +5 v power supply 2 3 ai i analog receive signal input. 3 5 ao o analog transmit signal output. 4 6 eai i external analog signal input. the signal applied to this pin is transmitted from ao via transmit output amplifier. when not using this pin, it should be left open. 5 7 gnd ground, 0 v. 6 8 x1 i 3.579545 mhz crystal resonator should be connected to x1 and x2. when applying external clock 3.579545 mhz to the device, it should be applied to x2 (not x1) via an ac-coupling capacitor of 100 pf and x1 has to be opened. 710 x2 o 8 12 clk o 3.579545 mhz clock signal output. 913 rd o modem receive serial data output. digital "1" and "0" correspond to "mark" and "space", respectively. when cd (carrier detect) is off, rd is held at "mark" state. 10 15 cd o fsk receive signal and answer tone detect. digital "0" and "1" represent "detect" and "non-detect", respectively. 11 17 xd i* modem transmit serial data input. digital "1" and "0" correspond to "mark" and "space", respectively. 12 18 rs i* fsk signal and answer tone transmit enable. when digital "0" is applied to rs , transmitting becomes enable. 13 19 test i* chip test input. test should be open or digital "1". 14 20 mod1 i* operation mode select. refer to table 1. 15 22 mod2 i* 16 24 aog i* analog transmit signal amplitude select. digital "1" ? C10 dbm typ. at ao digital "0" ? C4 dbm typ. at ao description name i/o rs gs-vk no.
semiconductor MSM7512B 5/12 absolute maximum ratings recommended operating conditions electrical characteristics dc characteristics * internally pulled-up pins power supply voltage v dd ta = 25c, with respect to gnd C0.3 to +7 v input voltage v in C0.3 to v dd + 0.3 v storage temperature t stg C55 to +150 c symbol condition rating unit parameter ( v dd = +2.7 v to +5.5 v, top = C40c to +85c) power supply current i dd operating mode 5.0 10.0 ma i ss power down mode 5.0 20.0 m a digital input voltage v il 0 0.8 v v ih 2.2 v dd v digital input leakage current i il v i = 0 v * C80 10 m a i ih v i = 5 v C10 10 m a digital output voltage v ol i ol = 1.6 ma 0 0.2 0.4 v v oh i oh = C0.4 ma 2.4 v dd v symbol condition min. typ. max. unit parameter unit max. typ. min. condition symbol power supply voltage v +5.5 +2.7 v dd operating temperature c +85 C40 t op input clock frequency % +0.1 C0.1 to 3.579545 mhz f clk v dd bypass capacitor m f 10 v dd C gnd c vdd oscillation frequency mhz 3.579545 frequency deviation ppm +100 C100 +25c 5c temperature characteristics ppm +50 C50 C40c to +85c equivalent series resistance w 50 load capacitance pf 16 crystal parameter
semiconductor MSM7512B 6/12 ac characteristics modulator/analog output (ao) characteristics * 0 dbm = 0.775 vrms (v dd = +2.7 v to +5.5 v, top = C40c to +85c) f dm f ds 1200 bps transmit mode xd = "1" xd = "0" 1296 2096 1300 2100 1304 2104 hz hz f bm f bs 75 bps transmit mode xd = "1" xd = "0" 386 446 390 450 394 454 hz hz fsk transmit signal frequency fsk transmit signal amplitude ratio v ao (mark) C v ao (space) C2 0 2 db v aod v sps p : in-band signal energy 4 khz to 8 khz 8 khz to 12 khz pC20 pC40 db db more than12 khz pC60 db out-of-band energy to v dd /2 C150 +150 mv v off output offset voltage 600 w r ao output load resistance symbol condition min. typ. max. unit parameter v ao1 v ao2 v o aog = "0" aog = "1" C6 C12 C4 C10 C2 C8 dbm dbm fsk transmit signal answer tone amplitude v ea1 v ea2 v ao C v eai aog = "0" aog = "1" C2 C8 0 C6 2 C4 db db analog external input signal gain
semiconductor MSM7512B 7/12 demodulator analog input (al, eai) characteristics * 0 dbm = 0.775 vrms t cdd ai cd t cdh figure 1 carrier detect ( cd ) timing ( v dd = +2.7 v to +5.5 v, top = C40c to +85c) v on ? v off 2db v hys hysteresis ( cd ) ai 10 m w r ai input resistance symbol condition min. typ. max. unit parameter fsk signal, at ai C6 dbm v ai receive signal amplitude v on v off fsk signal, (1:1) at ai off ? on off ? off C48 C42 dbm dbm receive signal detect amplitude ( cd ) see fig. 1 51520ms t cdd cd delay time 20 40 60 ms t cdh cd hold time 1200 bps, 1:1 pattern C10 10 % d bs receive data ( rd ) bias distortion eai 20 k w r eai
semiconductor MSM7512B 8/12 ai ao phone line receive filter rd xd dte transmit filter demodulator modulator phone line ai ao rd xd dte sg receive filter transmit filter demodulator modulator ai ao phone line receive filter rd xd dte transmit filter demodulator modulator sg v dd operation mode table 1 operation mode figure 4 analog loop back test mode figure 2 fsk transmit mode figure 3 fsk receive mode mod2 mod1 00 fsk transmit mode (fig.2) 01 fsk receive & 75 bps transmit mode (fig.3) 10 analog loop back test mode (fig. 4) 11 power down mode mode
semiconductor MSM7512B 9/12 application circuit MSM7512Brs 1 ao ai v dd eai gnd x1 x2 mod 1 mod 2 aog test rs xd cd clk rd 16 cont. 8 9 2.2 m f 600 w line 600 w : 600 w 2.2 m f external analog transmit signal 100 pf external clock 3.58 mhz 10 m f C + MSM7512Brs 1 ao ai v dd 10 m f eai gnd x1 x2 mod 1 mod 2 aog test rs xd cd clk rd C + 16 3.58 mhz cont. 8 9 2.2 m f 600 w line 600 w : 600 w to other circuit
semiconductor MSM7512B 10/12 an example of the external adjustment for a transmitting level and detecting level if you desire to change the transmitting level or detecting level, adjust the external circuit by referring to the following circuit. line transmitting level : v aol = v ao (r2/r1) ic input level : v ai = v ail (r4/r3) line 2.2 m f 51 k w 51 k w 600 w r2 ai 600 w r4 r3 r1 vaol vao vai ao 2.2 m f 51 k w 51 k w vail C + C + C +
semiconductor MSM7512B 11/12 (unit : mm) package dimensions dip16-p-300-2.54 package material lead frame material pin treatment solder plate thickness package weight (g) epoxy resin 42 alloy solder plating 5 m m or more 0.99 typ.
semiconductor MSM7512B 12/12 (unit : mm) notes for mounting the surface mount type package the sop, qfp, tsop, soj, qfj (plcc), shp and bga are surface mount type packages, which are very susceptible to heat in reflow mounting and humidity absorbed in storage. therefore, before you perform reflow mounting, contact okis responsible sales person for the product name, package name, pin number, package code and desired mounting conditions (reflow method, temperature and times). sop24-p-430-1.27-k package material lead frame material pin treatment solder plate thickness package weight (g) epoxy resin 42 alloy solder plating 5 m m or more 0.58 typ. mirror finish

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